Karlsruhe Institute of Technology has demonstrated photonic wire bonding between two SOI chips. They have demonstrated an aggregate data transmission rate of 5.25 Tbit/s over one photonic wire. Assuming a linear wire bond pitch of 5 microns, they conclude that a transmission rate of 1 Pbit/s/mm from a chip is within reach.
The photonic wire bonds are manufactured by two-photon lithography in SU-8 resist. One can easily envision taking this technology into manufacturing. It should enable very high speed chip-chip communication.
For details, see arXiv:1111.0651v1.